Packaging and Bundle
Analyzing the internal and external packaging we note that, although economic, it allows an easy organization of internal components and a good overall toughness. The descriptions are clear and simple and the images related to the new improvements are very clear as well. The rear of the box contains information about the product warranty. The used languages are Japanese, English and French.
The box containing the internal fan brackets and the bundle is very basic, but here again we see the meticulousness of the Japanese company, there's even a little slot where you can insert your index finger to push the content out of the small package. The bundle includes the manual, fan brackets, screws, the allen key necessary for the backplate, the backplate itself and finally brackets for various Intel and AMD sockets. Note that there is not present the classic syringe of thermal compound, but there is only a small pouch containing our beloved solution, in this case with silver percentages. Here is the complete list of what you'll find inside the box:
- 1 Mugen 3 heat-sink
- 1 PWM 120mm fan
- 1 installation manual
- 1 small pouch of thermal compound containing silver
- 2 mounting brackets for the fan
- mounting kit for Intel LGA775/1155/1156/1366
- mounting kit for AMD AM2/AM2 + / AM3 CPUs.